无铅钎料焊点界面与剪切行为的研究  

Study on interface and shear behavior in lead-free solder joint

作　　者：丁亚萍[1] 齐芳娟[1] 孙莉[1] 杨明辉[1] 

机构地区：[1]石家庄铁道学院材料科学与工程分院,河北石家庄050043

出　　处：《电子元件与材料》2008年第1期74-76,共3页Electronic Components And Materials

基　　金：河北省自然科学基金资助项目(E2006000832);河北省教育厅自然科学基金资助项目(2005206)

摘　　要：研究了三种不同合金钎料回流时间和老化时间对焊点界面行为和剪切性能的影响。结果表明：回流时间和老化对金属间化合物的生长和剪切力有相似的影响；焊后界面处和焊料中均有明显的金属间化合物；随着回流时间和老化时间的延长，金属间化合物生长明显。层厚不断增大；界面形貌从长针状转变成扇贝状，并且齿高减小；合金成分对剪切力影响不明显。在中速应变率下，剪切力减小。Sn-3.5Ag显现出较好的剪切性能，剪切力为77-82N。The influences of reflow time and aging time in three lead-free solders on solder joint interface and shear strength were investigated. The results show that the effect of reflow time and aging time on IMC and shear force is quite similar. IMC remarkably develop with increasing reflow and aging time, shear force decreases. In addition, it is also found that the effect of alloy component on shear force is not significant, and Sn-3.5Ag presents the better shear property than the others, shear force is 77-82 N.

关 键 词：电子技术 无铅钎料 金属间化合物 剪切强度 

分 类 号：TG425.1[金属学及工艺—焊接]