电子封装用Sip/Al复合材料的微观组织  

Study on Microstructure of Sip/Al Composite Applied to Electronic Packaging

作　　者：刘晓艳[1] 于家康[1] 

机构地区：[1]西北工业大学凝固技术国家重点实验室,陕西西安710072

出　　处：《热加工工艺》2008年第2期13-16,共4页Hot Working Technology

基　　金：国家自然科学基金资助项目(69976022)

摘　　要：用气压浸渗法制备了Sip/Al复合材料,并对所制备的复合材料的微观组织进行了研究。光学显微镜观察显示,复合材料中硅颗粒分布组织均匀、致密,有少量的孔隙存在。SEM+EDS分析发现,Si颗粒有少量的溶解,并且在溶解的Si颗粒表面有氧化物界面层生成。XRD分析结果表明,在复合材料界面中没有金属间化合物的生成。Silicon particle reinforced Al-base composite was fabricated by gas pressure infiltration techniques, and microstructure of the composite was investigated. The results show that the distribution of silicon particles in the composite is uniform and compact through optical microscope examination, but few porosities exist in composite. It has been found that some silicon particles are dissolved and new oxide interface is formed in the surface of the original particles observed by SEM combine with EDS analysis. XRD examination indicates that no intermetallic compound is formed in the composite.

关 键 词：压力浸渗 复合材料 微观组织 界面 电子封装 

分 类 号：TB33[一般工业技术—材料科学与工程]