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机构地区:[1]南京航空航天大学材料科学与技术学院,南京210016
出 处:《南京航空航天大学学报》2008年第1期120-124,共5页Journal of Nanjing University of Aeronautics & Astronautics
摘 要:微胶囊固化剂是一类新型的环氧树脂固化剂,利用其潜伏性可以提高树脂的储存稳定性,从而解决了两相固化体系的一些弊端。文中用溶有芯材的二氯甲烷(DCM)作为溶剂相的溶剂蒸发法制备了热塑性树脂为壁材的改性固化剂微胶囊,通过粒径分析和SEM观察微胶囊的表面形貌来确定微胶囊的制备工艺参数。结果表明:有机溶剂的蒸发温度过高或速度过快则不能形成微胶囊;选择8%的聚乙烯醇(PVA)表面活性剂、900 r/min乳化转速、芯壁比1∶1时制得的微胶囊表面光滑致密,微胶囊粒径1μm之内,并且分布比较窄。Microcapsule mold-curing agent can improve the storage stability of epoxy resin as a new type latent curing agent, thus solving problems of two-package type resin. The modified curing agent is encapsulated by solvent evaporation method with thermoplastic resin as shell material. A water phase is used as the internal water phase and the solvent of dichloromethane (DCM) dissolving core material is used as the oil phase. The particle size distribution and SEM are used to characterize the encapsulation effects of microcapsules. Experimental results show that evaporation temperature and time of organic solvent affect the encapsulation. The morphology of microcapsules is compact and sequent while the concentration of PVA as the dispersion agent is 8 %, the stirring speed is 900 r/min, the ratio of the core to coating is 1 : 1, and the particle size is uniform and no more than 1 μm.
分 类 号:TQ320.2[化学工程—合成树脂塑料工业]
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