金属基复合材料的界面分析  

Interfacial Analysis of Metal matrix Composites

作　　者：黄大千[1] 童华[1] 

机构地区：[1]武汉大学测试中心

出　　处：《分析测试学报》1997年第2期57-60,共4页Journal of Instrumental Analysis

摘　　要：用透射电镜、扫描电镜、Ｘ射线能谱仪和电子探针研究了碳化硅颗粒（ＳｉＣｐ）增强Ａｌ２０１４复合材料的微观结构和界面。鉴定了界面上和基体中三种主要的沉淀相：ＣｕＡｌ２、Ｃｕ２Ｍｇ８Ｓｉ６Ａｌ５、（Ｍｎ，Ｆｅ）３ＳｉＡｌ１２和高温下形成的条状Ａｌ４Ｃ３。试验指出，碳化硅和基体间的界面上没有Ｓｉ和Ａｌ的相互扩散。The interface and microstructure of the Al 2014 composites reinforced by SiC p particles have been characterized by transmission electron microscopy,scanning electron microscopy, X ray energy dispersive spectrometry and electron probe microanalyzer. At the interface between the SiC p and Al 2014 phases, three major intermetallic phases have been identified,namely, CuAl 2,Cu 2Mg 8Si 6Al 5, and (Mn, Fe) 3SiAl 12 . Lath like Al 4C 3 particles are also formed at high temperatures. Diffusion of silicon and aluminum across the interface between SiC p and the matrix has not been found.However, precipitate free zones and high density dislocation around the SiC p particles were observed.

关 键 词：透射电镜 复合材料 界面 金属基 碳化硅 铝合金 

分 类 号：TB333[一般工业技术—材料科学与工程]