Sn-Zn无铅钎料合金化改性研究  

Study of Sn-Zn Lead-free Solder by Alloying

作　　者：吴松[1] 康慧[1] 曲平[1] 

机构地区：[1]北京航空航天大学,北京100083

出　　处：《电子工艺技术》2008年第2期66-70,共5页Electronics Process Technology

摘　　要：各国立法限制或禁止Pb的使用极大地促进了无铅钎料的研究和应用。Sn-Zn钎料作为一种很有潜力的钎料,引起了研究人员的广泛兴趣,成为了无铅钎料的研究热点。加入合金元素能显著改善Sn-Zn钎料的性能。本文阐述了加入Ag、Cu、Zn、Bi、Re、Al等金属对Sn-Zn钎料的熔点、润湿性、力学性能、抗氧化腐蚀以及接头的金属间化合物(IMC)方面的影响。最后简单阐述了Sn-Zn钎料的应用现状和未来的改进方向。Study and application of Lead-free Solder is accelerating because of the restriction and prohibition of lead-containing solders by legislation.Sn-Zn has gained much attention from researcher.It is considered as a much potential Lead-free Solder and become more and more hot.Alloy elements were added to Sn-Zn Lead-free Solder for better the properties.The effect of different alloy elements added to Sn-Zn based lead-free solders on the solder ability of the solders,melting point,mechanics properties of soldered joints,corrosion and oxidation resistance,intermetallic compounds（IMC） was indicated.Finally the application status and the future direction of improvement had been introduced.

关 键 词：无铅钎料 SN-ZN 合金化 应用 

分 类 号：TN604[电子电信—电路与系统]