钢丝化学镀铜工艺研究和理论探讨  

Research for the Technology of Copper plating by Chemical Displacement on Steel Wire and the Theoretical Discussion

作　　者：冯绍彬[1] 董会超[1] 夏同驰[1] 孙喜莲[1] 

机构地区：[1]郑州轻工业学院

出　　处：《金属制品》1997年第4期12-15,共4页Metal Products

摘　　要：分析置换镀铜的电化学沉积机理，研制出提高铜层结合强度的专用添加剂和防锈钝化剂，能有效地增加镀层致密度和抗锈蚀性能。To present the electrochemical deposition mechanism of copper plating by displacement Specialized additives and rust proofing passivators to improve the bonding strength of copper coating onto steel wire are developed The products above can increase the compactness and antirust property of the copper coating effectively

关 键 词：钢丝 镀铜 添加剂 钝化剂 镀层 铜 沉积 

分 类 号：TG356.27[金属学及工艺—金属压力加工] TQ153.14[化学工程—电化学工业]