塑料电子封装件中湿扩散有限元分析  

The FEA Simulation of Moisture Diffusion in Electronic Packages

作　　者：徐建辉[1] 

机构地区：[1]上海电机学院机械学院,上海200245

出　　处：《上海电机学院学报》2008年第1期20-23,共4页Journal of Shanghai Dianji University

摘　　要：提出了FCPBGA封装中湿扩散行为的数学模型和有限元分析模型,并应用Abaqus软件包对FCPBGA封装中湿扩散行为进行数值模拟。结果表明,在树脂板中发生的湿扩散将使其水分逐渐增加,在制造过程中应予以充分注意。In this paper, the mathematical model and the FEM model of Moisture Diffusion in the FCPBGA packages have been proposed and Abaqus is employed to simulate the moisture diffusion in Plastic IC packages. As a result, the water will increase gradually because of the moisture diffusion in pitch, which must be paid much attention to in manufacturing process.

关 键 词：电子封装 湿扩散 有限元 

分 类 号：TN305.94[电子电信—物理电子学]