金属薄膜电阻率与表面粗糙度、残余应力的关系  

Relationship between Resistivity of Metallic Film and Its Surface Roughness,Residual Stress

作　　者：唐武[1] 邓龙江[1] 徐可为[2] Jian LU 

机构地区：[1]电子科技大学电子薄膜与集成器件国家重点实验室,四川成都610054 [2]西安交通大学,陕西西安710049 [3]LASMIS,Université de Technologic de Troyes,10010Troyès Cedex,France

出　　处：《稀有金属材料与工程》2008年第4期617-620,共4页Rare Metal Materials and Engineering

基　　金：国家自然科学基金(50601005)

摘　　要：针对磁控溅射Au金属薄膜,从实验角度研究了该薄膜电阻率与表面粗糙度、残余应力的关系,并对结果进行了分析。结果表明:薄膜电阻率随着表面粗糙度及残余应力的增加而增大。分析认为,晶体取向可能在金属薄膜力学性能和功能性之间有某种联系,并从应变能角度给予了解释。该结果为进一步探讨薄膜力学性能和功能特性的内在关系提供了研究基础。Au film was fabricated on Al2O3 substrate by magnetron sputtering. The relationship between resistivity of metallic film and its surface roughness, residual stress was investigated according to experimental results. The results show that the resistivity of the metallic film correlates with surface roughness and residual stress. The increase of resistivity with surface roughness and tensile residual stress can be explained by the strain energy theory. It can be inferred that crystal orientation may be connect with the mechanical behavior and functional property of metallic film.

关 键 词：金属薄膜 电阻率 表面粗糙度 残余应力 

分 类 号：O484[理学—固体物理]