唑类缓蚀剂在电路板生产上的应用  

The Use of Azoles in PCB Fabrication

作　　者：吴永炘[1] 刘鸣江[1] 麦志全 许淳淳[2] 

机构地区：[1]香港理工大学应用生物及化学科学系 [2]北京化工大学

出　　处：《电镀与涂饰》1997年第4期11-14,共4页Electroplating & Finishing

摘　　要：鉴于电路板生产过程中环保和成本的要求，采用唑类缓蚀剂取代传统的锡铅合金镀层以保证可焊性。探讨了唑类缓蚀剂的保护机理、应用情况及发展前景。In view of the improvement on environmental protection and the reduction of costs for PCBfabrication, emphasis has been placed on the use of corrosion inhibitors as replacements for conventional tin -lead electrodeposits for the preservation of solderability. The protection mechanism of azolesas well its their application rsults and challenge in future was investigated.

关 键 词：电路板 缓蚀剂 唑类 缓蚀剂 

分 类 号：TN710.04[电子电信—电路与系统]