基于近似模型的电子封装散热结构优化设计  

Optimization Design of Heat-Dissipating Structures for Electronic Packages Based on Approximation Model

作　　者：任远[1] 白广忱[1] 

机构地区：[1]北京航空航天大学能源与动力工程学院,北京100083

出　　处：《半导体技术》2008年第5期417-421,共5页Semiconductor Technology

摘　　要：针对封装散热结构优化问题中存在的难点,提出了一种基于近似模型和随机模拟的快速全局优化方法。利用Kriging方法建立封装散热结构的近似模型,重构原始的优化问题,采用随机模拟对重构出的目标函数进行寻优,从而得到最优解。采用CVT试验设计,使Kriging模型的泛化预测能力达到最大程度的发挥;在随机模拟中采用Quasi-Monte Carlo法,有效地提高了寻优的效率。以方形扁平封装器件为例,应用该方法实现了封装散热结构的优化,结果表明所提出的方法有效地解决了设计变量中含有离散变量的问题,并且大大提高了随机模拟优化的计算效率。To overcome the difficulties in the optimization of heat-dissipating structures for electronic packages, a fast global optimization method based on approximation model and stochastic simulation was proposed. The Kriging method was used to establish the approximation model of the heat-dissipating structure for electronic package, and the original optimal problem was reconstructed. The reconstructed objective function was solved by stochastic simulations. CVT experimental design was used to make sure that the Kriging model established had good generalization ability. Quasi-Monte Carlo method was adopted to improve the efficiency of finding the optimal solutions. Taking a quad flat package for example, the proposed method was applied to the optimization design of heat-dissipating structure. The results show that the proposed method can effectively solve the optimal problems with discrete variables, and greatly improve the calculation efficiency of the stochastic simulation for optimization.

关 键 词：近似模型 随机模拟 电子封装 热设计 

分 类 号：TN602[电子电信—电路与系统] TP391.72[自动化与计算机技术—计算机应用技术]