中间层对金刚石膜-硬质合金残余应力的影响  

Effect of Interlayer on Residual Stresses of Diamond Films-cemented Carbide

作　　者：唐达培[1] 高庆[1] 

机构地区：[1]西南交通大学应用力学与工程系,成都610031

出　　处：《人工晶体学报》2008年第2期456-460,共5页Journal of Synthetic Crystals

基　　金：四川省青年科技基金;四川省应用基础研究项目(No.07JY029-151);西南交通大学科学研究基金;博士生创新基金项目

摘　　要：为了给金刚石膜与硬质合金基体之间中间层的选用和设计提供有益的参考,采用三维热-力耦合有限元方法,研究了中间层对界面处热残余应力的影响。分别对有与没有中间层、以及不同的中间层材料和不同的中间层厚度（0.2~2μm）条件下界面处的热残余应力进行了模拟计算和比较。模拟结果表明,当选取热膨胀系数较小、弹性模量较低、厚度在1μm左右的中间层时,可使热残余应力的减小幅度增大,有利于金刚石膜在界面处的结合。In order to provide some profitable references for the choice and design of interlayer between diamond films and cemented carbide substrate, the effect of interlayer on thermal residual stresses at interfaces was investigated by using the 3-dimensional thermal-mechanical coupling finite element method. The thermal residual stresses at interfaces were simulated and compared respectively under the circumstances of with and without interlayer, different interlayer materials and different interlayer thickness （0.2-2 μm）. The results show that the thermal residual stresses may be reduced to a great extent when the interlayer that has little thermal expansion coefficient, low elastic modulus and about 1 μm thickness is selected, which is beneficial to the cohesion of the diamond films at interfaces.

关 键 词：中间层 金刚石膜 硬质合金 残余应力 

分 类 号：TB125[理学—工程力学]