Ni离子注入纯铜的表面改性  

Surface modification of pure copper by Ni ion implantation

作　　者：白亚奎[1] 李杰池[1] 郑瑞廷[1] 程国安[1] 

机构地区：[1]北京师范大学低能核物理研究所射线束技术与材料改性教育部重点实验室北京市辐射中心,北京100875

出　　处：《中国有色金属学报》2008年第5期818-822,共5页The Chinese Journal of Nonferrous Metals

基　　金：国家自然科学基金资助项目(10576003)

摘　　要：采用MEVVA源离子注入设备进行了纯铜表面镍离子注入的改性实验研究,采用透射电镜和X射线衍射仪对改性层显微组织进行分析表征。结果表明:随着Ni离子注入剂量的增加,铜表面改性层发生一系列强化过程。纳米硬度和摩擦磨损实验结果表明:当注入剂量达到7.5×1017 ion/cm2时,注入层的硬度值可达基体的2倍,滑动摩擦因数仅为基体的47%。高剂量的离子注入是对纯铜进行表面改性的一种有效的方法。The impact on the surface of pure copper performance with Nickel ion implantation was studied using MEVVA source ion implantation equipment. The microstructures of modified layer were analyzed by TEM and XRD. The results show that a series of strengthening process occur on the modified surface of copper with the increase of Ni ion implantation dose on surface of copper. The testing results of hardness and friction indicate that the surface hardness is 2 times as that of original copper surface when the ion implanted dose is 7.5×10^17ion/cm2, and the friction coefficient is only 47% of that of copper surface. It can be concluded that ion implantation on the surface of pure copper, especially strong current ion implantation, is an effective method of pure copper surface strengthening technology.

关 键 词：镍 铜 离子注入 表面改性 

分 类 号：O484.2[理学—固体物理] TG174.444[理学—物理]