日本电子电镀工业中的化学镀金工艺(一)  

Electroless gold plating technics in electronic plating industry in Japan—part one

作　　者：嵇永康 胡培荣[2] 卫中领[3] 

机构地区：[1]苏州华杰电子有限公司,江苏苏州215002 [2]苏州大学特种化学试剂实业公司,江苏苏州215002 [3]中国科学院上海微系统与信息技术研究所金属腐蚀与防护技术中心,上海200050

出　　处：《电镀与涂饰》2008年第5期26-29,共4页Electroplating & Finishing

摘　　要：本文分2部分,介绍了日本电子电镀工业化学镀金工艺。第一部分论述了早期使用的硼氢化钾和DMAB两种镀液体系的组成及反应机理。指出了两种镀液体系存在的问题。提出了提高镀速的8种措施。The paper is to be published in two parts, introducing the electroless gold plating process in electronic plating industry in Japan. In the first part, the composition and reaction mechanism of two bath systems of potassium borohydride and D＇MAB used in the early period were discussed. Problems existing in the two bath system were presented. Eight kinds of measures improving electroless gold plating rate were suggested.

关 键 词：电子电镀 化学镀金 硼氢化钾 二甲胺硼烷 镀速 

分 类 号：TG178[金属学及工艺—金属表面处理] TQ153[金属学及工艺—金属学]