SnAgCuEr系稀土无铅钎料的显微组织与性能研究  

Microstructure and performance of SnAgCuEr lead-free solders with rare earth

作　　者：田君[1] 郝虎[1] 史耀武[1] 雷永平[1] 夏志东[1] 

机构地区：[1]北京工业大学材料科学与工程学院,北京100022

出　　处：《材料科学与工艺》2008年第2期281-283,共3页Materials Science and Technology

基　　金：国家高技术发展计划资助项目(2002AA322040)

摘　　要：系统研究了添加微量稀土Er对Sn3.8Ag0.7Cu钎料合金显微组织和性能的影响,通过对钎料的熔化温度、润湿性能、接头剪切强度的测试及显微组织观察,指出含微量稀土的SnAgCuEr合金是性能优良的无铅钎料合金,同时确定了最佳的Er含量范围.The effect of minimal amount of rare earth Er on the microstructure and performance of Sn3.8Ag0.7Cu solder alloy, has been systematically investigated. Through measuring the melting temperature, wettability and joint shear strength, and observing the microstructure, it is indicated that the SnAgCuEr alloy containing rare earth is a lead - free solder with an excellent performance. At the same time the best content of Er is de- termined.

关 键 词：无铅钎料 SnAgCu合金 稀土Er 

分 类 号：TG425.1[金属学及工艺—焊接]