晶圆测试探针新的测试价值  

Wafer Probe Acquires a New Importance in Testing

作　　者：Mark Allison 

机构地区：[1]Electroglas Inc. SanJose,Calif

出　　处：《电子工业专用设备》2008年第4期38-41,共4页Equipment for Electronic Products Manufacturing

摘　　要：晶圆测试探针曾被认为是节约废芯片封装成本的一种方法,现今它却成为工艺控制、成品率管理、产品质量以及总测试成本的一个关键因素。此外,随着组装相关的故障测试之后,封装水准晶圆分选的完全测试不久将会来临。Wafer probe was once considered a method for saving packaging costs of bad die. Today, it＇s a critical element in process control, yield management, yield enhancement and customer quality-as well as overall cost of test. Moreover, full testing at wafer sort （probe）, followed by testing for assembly-related failures at the package level, may not be far away.

关 键 词：晶圆测试探针 封装成本 成品率管理 晶圆分选 探卡 测试成本 

分 类 号：TN307[电子电信—物理电子学]