铜与金引线的特性比较  

Characteristic Comparison Between Cu and Au Wire

作　　者：S.H.Kim J.T.Moon 

机构地区：[1]MKElectronCo.Ltd,Korea

出　　处：《电子工业专用设备》2008年第5期57-59,共3页Equipment for Electronic Products Manufacturing

摘　　要：近来由于黄金价格的强势增长,使得作为低成本键合引线的的铜丝受到众多封装界内的关注。如一些粗引线的低引脚封装,业已用铜引线在批量生产中获得成功。当采用这种引线时,它需要一些与金引线不同的条件,例如氧化的程度,机械特性,键合机操作的应用范围等。因此,当用户开始采用铜引线时,就必须考虑减少试验和误差。如果黄金价格继续走高,向铜引线的转化速度将会加快。Recently Gold price is increased much higher. So Copper wire as low cost bonding wire, is interested in various package groups. And some package having low-pin count of thick size wires, have already been succeeded mass production using Copper wire. When this wire applied, it needed some different conditions from Gold wire. It is resulted from the difference characteristics between Copper and Gold wire like degree of oxidation, mechanical properties, application range for bonder operation and etc.. Therefore, when user starts to apply Copper wire, they must consider these problems to reduce trial and error. And if higher Gold price is keeping, conversion speed of Copper wire will be accelerated.

关 键 词：金价 键合引线 封装成本 铜引线 金引线 

分 类 号：TN305.96[电子电信—物理电子学]