晶粒度对纳米铜粉抗氧化能力的影响(英文)  

Effect of the Grain Size on the Anti-Oxidizing Ability of Copper Nano-Powders

作　　者：李在元[1] 翟玉春[1] 

机构地区：[1]东北大学材料与冶金学院,沈阳110004

出　　处：《微纳电子技术》2008年第6期334-337,360,共5页Micronanoelectronic Technology

摘　　要：以KBH4和维生素C(VC)为还原剂,以CuSO4·5H2O为原料,以EDTA为络合剂,PVP为分散剂,用液相还原法制备不同晶粒度的纳米铜粉。不同晶粒度的纳米铜粉同时在空气中放置1h后,进行XRD、DTA-TG以及TEM检测。结果表明:不同粒度的纳米铜粉在空气中抗氧化能力不同,晶粒度越大抗氧化能力越强。晶粒度大于75nm时在空气中放置1h不被氧化,平均晶粒度为75nm的纳米铜粉在120℃时开始氧化。纳米铜粉的熔点很低,进行TEM检测时,在电子束照射下颗粒熔融长大。Taken KBH4 and vitamin C （VC） as reducers, CuSO4 · 5H2O as a raw material, EDTA as a complex agent and polyvinyl-pyrolidone （PVP） as a protector, the copper nano-powders were prepared by the liquid reduction method. Placed the powders with different grain sizes in air for an hour, the powders were then examined by XRD, DTA-TG and TEM. The results reveal that the anti-oxidizing ability of the copper nano-powders depends on their grain sizes. When the grain size of the copper nano-powder is bigger, the anti-oxidizing ability is better. If the granularity of the powder is bigger than 75 nm, the powder will not be easily oxidized in air. The 75 nm copper nano-powder samples begin to be oxidized at 120 ℃. The melting point of the copper nano-powder is very low, so the grain will melt and grow up quickly under the TEM electron beam.

关 键 词：纳米铜粉 液相还原 硼氢化钾 维生素C 抗氧化能力 

分 类 号：TB383[一般工业技术—材料科学与工程] TG146.11[金属学及工艺—金属材料]