化学镀镍中铜被腐蚀的机制及其对策  

ANALYSIS OF THE COPPER CORROSION MECHANISM DURING THE ELECTROLESS DEPOSIT OF Ni AND A COUNTERMEASURE

作　　者：夏承钰[1] 

机构地区：[1]西安理工大学,西安710048

出　　处：《腐蚀与防护》1997年第6期19-21,共3页Corrosion & Protection

摘　　要：分析了化学镀镍槽液引起铜腐蚀和导致化学镀镍过程中障碍的机制,并提出了相应对策.The copper corrosion mechanism which is resulted from the electroless deposit Ni bath solution and the mechanism which leads to a hitch in the process for electroless deposit Ni are analyzed. A countermeasure to overcome these problems is put forward in the present paper.

关 键 词：化学镀 铜腐蚀 镀镍 电镀 镀液 

分 类 号：TG174.36[金属学及工艺—金属表面处理] TQ153.12[金属学及工艺—金属学]