基于LTCC技术的X波段接收机前端设计与制作  

Design and fabrication of X band receiver front-end based on LTCC technology

作　　者：钱可伟[1] 曾志毅[1] 

机构地区：[1]电子科技大学电子科学技术研究院,四川成都610054

出　　处：《电子元件与材料》2008年第6期6-8,11,共4页Electronic Components And Materials

摘　　要：采用低温共烧陶瓷(LTCC)技术和三维立体组装技术设计制作了一种适用于X波段接收机的前端模块,并进行了测试。结果表明:设计制作出的接收机前端主要技术指标为:增益大于20 dB、噪声系数小于等于7.8 dB和1 dB压缩点功率大于等于10 dBm,层数为10层。在电气性能相当的情况下,其体积和质量相对于传统PCB组件有较大缩减。Using low temperature co-fired ceramics （LTCC） technology and three dimensional （3D） cubic packaging technology, a receiver front-end in X-band was designed and fabricated, then investigated. Results show that the receiver front-end shows the gain above 20 dB, noise figure below 7.8 dB and power at 1 dB compression point above 10 dBm. It has ten layers, and has great advantages in volume and weight compared with traditional PCB module when their electric performance is equal.

关 键 词：电子技术 低温共烧陶瓷 X波段接收机前端 

分 类 号：TN713[电子电信—电路与系统]