PBGA封装焊点寿命影响因素的有限元分析  

Study on Lifetime Impact Factors of Solder Joint in PBGA Packaging

作　　者：陈颖[1] 康锐[1] 

机构地区：[1]北京航空航天大学可靠性工程研究所,北京100083

出　　处：《半导体技术》2008年第7期563-566,共4页Semiconductor Technology

基　　金：中国博士后基金资助项目(20060400393)

摘　　要：为明确PBGA焊点设计及环境温度参数对其可靠性影响,利用有限元软件ANSYS分析了温度循环、焊点材料、焊点高度与直径、PCB板的厚度、刚度、热膨胀系数(CTE)对焊点寿命的影响。焊点采用了Anand本构关系描述,寿命预测采用Darveaux模型。研究结果表明,温度循环的范围变大焊点寿命变短,保温时间缩短能增加焊点寿命;经过优化的焊球,寿命会增加;PCB板越厚,焊点寿命越短;PCB板的杨氏模量越大,焊点寿命越长。In order to clarify the impact of design and environment temperature on PBGA solder joint reliability, effect of temperature, solder material, height, diameter and gap of solder joint, thick, elastic module and CTE of PCB on solder joint lifetime were analyzed by FEA software ANSYS. Anand constitutive relation, Darveaux lifetime estimation model were utilized in the analysis. The results show that increase of the temperature scope, lifetime of solder joint will decrease. Increase dwell times will improved solder joint lifetime. Optimization of solder joint configuration will increase its lifetime. The thicker the PCB plate is, the shorter the lifetime is; the bigger young modulus is, the longer the lifetime is.

关 键 词：塑封球栅阵列封装 焊点 寿命 影响因素 有限元 

分 类 号：TN305.94[电子电信—物理电子学]