热循环条件下空洞对PBGA焊点热疲劳寿命的影响  

Effect of Void on the Thermal Fatigue Life of PBGA Solder Joint Under Thermal Cycles

作　　者：邱宝军[1] 周斌[1] 

机构地区：[1]信息产业部电子第五研究所可靠性物理及其应用技术国家重点实验室,广州510610

出　　处：《半导体技术》2008年第7期567-570,共4页Semiconductor Technology

基　　金：武器装备预研基金资助(9140c030301060c0301)

摘　　要：球栅阵列(ball grid array,BGA)封装器件的广泛应用使空洞对焊点可靠性的影响成为业界关注的焦点之一。采用非线性有限元分析方法和统一型粘塑性本构方程,以PBGA组装焊点为对象,建立了互连焊点热应变损伤的三维有限元模型,并基于修正的Coffin-Manson方程,分析了在热循环加载条件下不同位置和大小的空洞对焊点疲劳寿命的影响。研究结果显示,位于原应力集中区的空洞将降低焊点疲劳寿命,基于应变失效机理,焊点裂纹易在该类空洞周围萌生和扩展;位于焊球中心和远离原应力集中区的空洞,在一定程度上可提高焊点的疲劳寿命。The effect of void on the reliability of BGA （ball grid array） solder joint is a focus of concern as the BGA packages are used more and more extensively. PBGA solder joint with various voids was regarded as a target, the nonlinear finite element method and the unified visco-plastic Anand equation were employed to develop the 3D slice finite element model based on heat strain damage. The effect of different size and location of voids on the fatigue life of solder joint was studied using the amendatory Coffin-Manson equation. The results show that the voids locat at the initial stress concentration region have negative effect on the fatigue life of solder joint. It can be concluded that the fatigue crack of solder joint would initiate and propagate easily around the voids based on the mechanism of strain failure; but the voids can improve the fatigue life of solder joints to some extent when the voids located at the center of solder ball or keep away from the initial stress concentration region.

关 键 词：塑封球栅阵列封装 空洞 焊点 疲劳寿命 有限元 

分 类 号：TN604[电子电信—电路与系统]