基于ARM7的表贴元件包装机智能控制系统  

Intelligent Control System for Encapsulation Machine Based on ARM7

作　　者：高岩[1] 马丽娟[2] 

机构地区：[1]西安外事学院,西安710077 [2]西安工业大学,西安710025

出　　处：《包装工程》2008年第7期17-19,共3页Packaging Engineering

摘　　要：根据我国当前表帖元件包装机温度控制精度及封装效率都较低的现状,设计了基于ARM7处理器S3C44B0X的智能控制系统。介绍了该控制系统的硬件电路组成并给出了主程序流程,针对温度控制提出了带有加权因子的模糊控制算法。实际应用表明,该智能系统的控制效果优于常规控制系统。According to the low temperature control precision and low encapsulation efficiency of the encapsulation machine of small outline package IC, this paper introduced the intelligent control system. It is based on the S3C44B0X processor of ARM7. The algorithm of fuzzy control with weighting factor was also discussed. The implement of hardware and the flow chart of main program were provided as well. This control system had been proved to be effective in its application.

关 键 词：S3C44B0X 模糊控制 加权因子 表贴元件包装 

分 类 号：TB486.1[一般工业技术—包装工程]