热机电耦合智能板结构的一类有限元模型  

Finite Element Model for Thin Piezothermoelastic Intelligent Plate

作　　者：王小兵[1] 陈建军[1] 谢永强[1] 梁震涛[1] 陈永琴[1] 

机构地区：[1]西安电子科技大学机电工程学院,西安710071

出　　处：《应用力学学报》2008年第2期263-267,共5页Chinese Journal of Applied Mechanics

基　　金：国防预研基金(51421060505DZ0155);陕西省自然科学基金(2005A009)

摘　　要：针对热机电压电薄板结构,提出了一种包含4个位移节点、2个电势节点和8个温度节点的有限元模型,其位移场按平板壳单元描述,而电势场和温度场则按线性插值方法描述,并基于虚功原理导出了热机电有限元方程,通过比较,表明所得有限元方程的正确性。最后以悬臂板为例,对位移响应、温度响应和输出电压进行了数值仿真,凸现了在小挠度变形下,变化幅值较大的温度对输出电压的重大影响。For piezothermoelastic intelligent plate, a cube finite element model including 4 displacement nodes, 2 electric potential nodes and 8 temperature nodes is presented, the displacement field is defined by means of plane shell elements, and the electric potential field and temperature field are all described with linear interpolation; the detailed element equations are deduced following the virtual work principle. An intelligent cantilever plate is taken as the example , the responses of temperature field, displacement field and output voltages are simulated to show the influence of obviously varying temperature on the output voltages.

关 键 词：热-机-电耦合 有限单元法 计算机仿真 

分 类 号：O242.21[理学—计算数学]