表面组装电路模块多场耦合建模技术和现状分析  

作　　者：张立强[1] 吴兆华[1] 

机构地区：[1]桂林电子科技大学机电工程学院

出　　处：《现代表面贴装资讯》2008年第3期60-63,共4页Modern Surface Mounting Technology Information

摘　　要：近年来，随着电气互连技术的发展和表面组装技术的广泛应用，在高频等工作状态下，表面组装电路模块对其本身的电、磁、热等特性要求越来越高。对电磁场、热场理论基础以及它们之间的耦合和分析方法作了简要介绍。并对组装了BGA的PCB进行了热-力的耦合分析。In recent years, with the development of electric interlinkage technology and abroad application of surface mount technology, under the high frequency work state, the request of surface mount circuit module about itself electricity, magnetism and heat becomes higher and higher. It has been brief introduced that electromagnetism field, heat filed and their coupling and analysis method in this paper. And make coupling analysis about thermo-elasticity.

关 键 词：电磁 热 应力 耦合分析 

分 类 号：TN42[电子电信—微电子学与固体电子学]