FCBGA器件SnAgCu焊点疲劳寿命预测  

Fatigue life prediction of SnAgCu soldered joints of FCBGA device

作　　者：张亮 薛松柏[1] 韩宗杰[1] 卢方焱[1] 禹胜林[1] 赖忠民[1] 

机构地区：[1]南京航空航天大学材料科学与技术学院,南京210016

出　　处：《焊接学报》2008年第7期85-88,共4页Transactions of The China Welding Institution

基　　金：江苏省普通高校研究生科技创新计划资助项目(CX07B087z);2006年江苏省“六大人才高峰”资助项目(06-E-020)

摘　　要：采用Anand模型构建Sn3.0Ag0.5Cu钎料本构方程,分析FCBGA器件在无底充胶以及不同材料属性底充胶情况下焊点的应力分布。结果表明,无论底充胶存在与否,最拐角焊点上表面都是应力集中的区域。使用底充胶可以使焊点的残余应力减小,并且使其均匀分布于焊点上表面上。运用Engelmaier修正的Coffin-Mason模型计算焊点疲劳寿命,发现使用底充胶的器件焊点寿命明显高于无底充胶器件的焊点疲劳寿命。对底充胶属性参数研究发现,线膨胀系数的大小对焊点疲劳寿命影响很大,而弹性模量的影响却很小,通过参数的优化模拟,可以为底充胶的选择提供一定的理论指导。Anand model was used to establish the constitutive equation of Sn3.0Ag0.5Cu solder,and the stress distribution of soldered joints was analyzed with and without underfill.The results indicate that the stress concentrates on the top surface of outermost soldered joint whether the underfill is here or not,and the stress decreases and distributes evenly on the top surface of soldered joint by using of underfill.The Modified Coffin-Mason equation by Engelmaier was utilized to predict the fatigue life of soldered joint;the fatigue life of soldered joint with underfill is longer than that without it.The effects of underfill properties were investigated.The results indicate that the CTE of underfill influences strongly the fatigue life of soldered joints,but the influence of Young's Modulus is little,which will provide a theory guide for practical applications.

关 键 词：本构方程 底充胶 疲劳寿命 

分 类 号：TG454[金属学及工艺—焊接]