As^(5+)、Sb^(3+)、Bi^(3+) 对阴极铜沉积反应动力学的影响  

THE EFFECT OF As 5+ 、Sb 3+ 、Bi 3+ ON THE KINETICS OF CATHODIC COPPER DEPOSITION REACTION

作　　者：鲁道荣[1] 林建新[1] 

机构地区：[1]合肥工业大学化工学院

出　　处：《合肥工业大学学报（自然科学版）》1997年第5期51-56,共6页Journal of Hefei University of Technology：Natural Science

摘　　要：用线性电位扫描法研究了在准稳态条件下，Ａｓ５＋、Ｓｂ３＋、Ｂｉ３＋离子对酸性硫酸铜体系中阴极铜沉积反应动力学的影响。研究结果表明：Ａｓ５＋可以增大铜沉积反应的交换电流密度ｉ０，对铜沉积过程起去极化作用；Ｓｂ３＋和Ｂｉ３＋均使铜沉积反应的交换电流密度ｉ０减小，对铜沉积过程起极化作用；当Ａｓ５＋、Ｓｂ３＋、Ｂｉ３＋共存于电解液中时，对铜沉积反应亦起一定的极化作用，使铜沉积反应速度减缓，交换电流密度ｉ０降低。但是Ａｓ５＋、Ｓｂ３＋、Ｂｉ３＋对铜沉积反应的电荷传递系数α几乎无影响，因而它们存在于电解液中时，不会改变铜沉积的电化学反应机理。In this paper,we study the effect of As 5+ ,Sb 3+ ,Bi 3+ on kinetics of cathodic deposition of copper in acidified CuSO 4 system at quasi steady state condition by linear potential sweep method. The results obtained indicate that As 5+ ions increases the density of current exchanging of copper deposition reaction,and has an action of unpolarization on the process of copper deposition.Sb 3+ and Bi 3+ ions decreases the density of exchange current of copper deposition reaction,and has an action of polarization on the process of copper deposition. When As 5+ 、Sb 3+ 、Bi 3+ ions coexist in the electrolyte,they have an action of polarization on reaction of copper deposition,and decrease rate of copper deposition reaction,and decrease the density of current exchanging of copper deposition reaction (i 0). But As 5+ 、Sb 3+ 、Bi 3+ ions hardly effect on charge transfer coeffcient (α),they do not change electrochemical reaction mechanism of copper deposition, when they exist in the elctrolyte.

关 键 词：炼铜 电沉积 电解 反应动力学 

分 类 号：TF811.032[冶金工程—有色金属冶金]