剪切蠕变下无铅焊点厚度的尺寸效应  

Size effects of lead-free solder joints thickness under shear creep

作　　者：蒋礼[1] 张桂英[1] 周孑民[2] 

机构地区：[1]中南大学物理科学与技术学院,湖南长沙410083 [2]中南大学能源与动力工程学院,湖南长沙410083

出　　处：《电子元件与材料》2008年第8期55-58,共4页Electronic Components And Materials

基　　金：国家自然科学基金资助项目(No.50376076)

摘　　要：利用自制的电子测试系统,测量分析了试样焊点厚度(0.05～0.50mm)对电阻应变的影响。结果表明:在剪切蠕变条件下,焊点厚度为0.25mm时,电阻应变最小,蠕变寿命最长。利用有限元软件ANSYS对焊点的蠕变应变进行仿真分析。结果显示:随着焊点厚度变化,焊点蠕变应变的变化趋势与实验结果一致。将相同厚度下的电阻应变与蠕变应变进行拟合,得到了电阻应变与蠕变应变之间的定量关系式。The resistance strain of solder joints with different thickness （0.05-0.50 mm） were measured by a self-made apparatus. The results show that the solder joints with 0.25 mm thickness yield minimum resistance strain and the longest creep life. Creep strain of the solder joints were simulately analysed by finite element method （FEM）. The results show that FEM simulate analyses of the creep strain of solder joints present the same change trend as the experimental results when the solder joints＇ thickness changes. The quantificational relationships between resistance strain, creep strain and solder joints thickness were obtained according to the experimental data and the between creep strain and resistance strain was obtained FEM data, respectively. Finally, the quantificational relationship between creep strain and resistance strain was obtained.

关 键 词：电子技术 无铅焊点 尺寸效应 厚度 电阻应变 

分 类 号：TB34[一般工业技术—材料科学与工程] TB332