一种星载电子设备散热结构的设计与优化  

Design and Optimization of Spaceborne Electronic Equipment′s Heatspreader Structure

作　　者：朱金彪[1] 

机构地区：[1]中国科学院电子学研究所,北京100190

出　　处：《电子机械工程》2008年第4期11-13,共3页Electro-Mechanical Engineering

摘　　要：热沉面在顶面的芯片的散热结构设计一直是星载电子设备热设计的难题,常见的散热结构方案是采用和PCB等大小的整块金属导热板扣压在需要散热的芯片上进行散热,这增加了一些不必要的重量,与卫星降低重量的要求不符。文中设计了一种"散热帽"结构,使用Flotherm软件对其散热效果进行了仿真,并对其结构尺寸进行了优化设计,给出了散热帽结构可以有效散热的结论。通过对比分析散热帽结构和常见散热结构的重量,得出了散热帽结构可以有效减重的结论。One of the difficuhies in spaceborne electronic equipment＇s thermal design is heatspreader structure design for these chips whose heat sinks are on the top. Using a whole aluminium or copper heat-conducted plane to press on chips for heatspreader is a frequently used method, which would add unwanted weight and falls short of the need of lightening satellitic structure. This paper designed a cap-heatspreader structure. By flotherm software, heatspreader effect was simulated and dimensions were optimized. The result proved the cap-heatspreader structure could cool the chips effectively. Comparing with the whole metal plane, the cap - heatspreader structure could reduce weight effectively.

关 键 词：星载电子设备 散热帽结构 热分析 封装 

分 类 号：TN803[电子电信—信息与通信工程] TP302[自动化与计算机技术—计算机系统结构]