次磷酸钠和甲醛为还原剂的化学镀铜工艺对比  

Comparison between the Electroless Copper Plating Processes Using Sodiu m Hypophosphite and For maldehyde as Reductants

作　　者：杨防祖[1] 杨斌[1] 黄令[1] 许书楷[1] 姚光华[1] 周绍民[1] 

机构地区：[1]厦门大学化学化工学院,固体表面物理化学国家重点实验室,福建厦门361005

出　　处：《电镀与精饰》2008年第8期12-15,共4页Plating & Finishing

基　　金：国家科技攻关计划资助项目(2004BA325C)

摘　　要：比较并评价了以甲醛和以次磷酸钠为还原剂的化学镀铜工艺。结果表明,次磷酸钠镀铜液的稳定性高于甲醛镀铜液,次磷酸钠镀液的沉积速率高于甲醛镀液。以甲醛为还原剂的镀层晶粒细小,而以次磷酸钠为还原剂的镀层呈团粒状。甲醛镀铜层铜的质量分数接近100%,次磷酸钠镀铜层中铜的质量分数为93.9%,镍的质量分数为6.1%,镀层为铜-镍合金。以甲醛为还原剂的化学镀铜层的电导率、抗拉强度、延伸率等物理性能均优于次磷酸钠化学镀铜层。The processes of the electroless copper plating using sodium hypophosphite and formaldehyde as reductants were compared and evaluated. The results show that the electrolyte using sodium hypophosphite as reducing agent is more stable than that using formaldehyde as reducing agent; the electroless deposition rate of the sodium hypophosphite solution is higher than that of the formaldehyde bath ; the deposit grains are very fine and dense when using formaldehyde as reductant, and the other is of agglomerate morphology; the copper content in formaldehyde＇s deposit is nearly 100% （wt）, and the deposit from sodium hypophosphite bath contains 93.9% （wt） copper and 6.1% （wt） nickel ; the conductirity, tensile strength and ductibility of formaldehyde＇s deposit are better than that from the sodium hypophosphite solution.

关 键 词：化学镀铜 甲醛 次磷酸钠 

分 类 号：TQ153.14[化学工程—电化学工业]