铝硅镁合金化学镀镍  

Electroless nickel plating on AlSiMg alloy

作　　者：邱星武[1] 李刚[1] 徐洋[1] 任鑫[1] 

机构地区：[1]辽宁工程技术大学材料科学与工程系,辽宁阜新123000

出　　处：《电镀与涂饰》2008年第8期11-14,共4页Electroplating & Finishing

摘　　要：研究了在铝硅镁合金基体上直接化学镀镍和在基体上电镀铜后再化学镀镍2种工艺。采用扫描电子显微镜分析技术、盐雾法、锉刀法等试验方法比较了2种工艺所得镀层的表面形貌、耐蚀性和结合力。结果表明:2种样品的镍镀层都具有很好的耐蚀性及较好的结合力,对铝硅镁基体具有良好的保护作用。与铝硅镁合金直接化学镀镍相比,铝硅镁合金基体电镀铜后化学镀镍所得的镍层组织更致密,结合力更好,耐蚀性更优异。Two processes including direct electroless nickel plating and electroless nickel plating after a prior copper electroplating on AiSiMg alloy were studied. The surface morphologies of the deposits obtained by the two processes were compared by scanning electron microscopy, the corrosion resistance by salt spray test and the adhesion strength by file method. The results showed that the nickel deposits of the two samples have good corrosion resistance and good adhesion strength, and can provide a good protection for A1SiMg alloys. Comparing with the deposit obtained by direct electroless nickel plating, the deposit obtained by electroless nickel plating after a prior copper electroplating has more compact structure, stronger adhesion and superior corrosion resistance.

关 键 词：铝硅镁合金 化学镀镍 电镀铜 硬度 结合力 

分 类 号：TQ153.2[化学工程—电化学工业]