声表面波器件封装电磁互通效应的研究  

Research on Package Electromagnetic Interconnecting Effect of SAW Device

作　　者：马林[1] 方志华[1] 官伯然[1] 

机构地区：[1]杭州电子科技大学电子信息学院,浙江杭州310018

出　　处：《杭州电子科技大学学报（自然科学版）》2008年第4期13-16,共4页Journal of Hangzhou Dianzi University：Natural Sciences

摘　　要：随着声表面波器件的小型化和高频化,该器件对封装引起的电磁互通效应的影响越来越敏感。因此,为了器件的准确设计,就必须慎重考虑封装对器件性能的影响。该文利用声表面波梯形滤波器的LC等效电路原理来获得声表面波双工器的模型;建立该器件的封装结构模型,利用基于有限元法的全波分析工具来提取其S参数。结合两者的结果,模拟出封装对声表面波器件的影响。With miniaturization and high frequency of surface acoustic wave（SAW） device, this device is more and more sensitive to electromagnetic interonnecting effect caused by the package. In order to design device correctly, the package effect on the performance of device should be considered cautiously. In this paper, LC equivalent circuit principle of surface acoustic wave ladder type filter is applied to obtain the modeling of saw duplexer; the model of the duplexer package is created. Full - wave analysis tool which is based on the FEM, is used to get S - parameters of the package. At last, the models of duplexer and package are assembled together to simulate the total response.

关 键 词：声表面波 梯形谐振滤波器 封装效应 

分 类 号：TN13[电子电信—物理电子学]