钼粉上化学镀铜工艺的研究  

Study on Technique for Mo Powders with Electroless Copper Plating

作　　者：王光君[1] 王德志[1] 吴壮志[1] 汪异[1] 

机构地区：[1]中南大学,湖南长沙410083

出　　处：《稀有金属材料与工程》2008年第8期1491-1494,共4页Rare Metal Materials and Engineering

摘　　要：采用化学镀方法对平均粒度为3μm的钼粉进行化学镀铜,温度和pH值分别控制在55～75℃和11.5～13。利用X射线衍射分析镀后粉末的相组成,用SEM观察未镀铜和镀铜粉末的形貌。结果表明,温度65℃、pH值12.5为化学镀铜的最佳工艺,此时,铜含量达到46%（质量分数,下同）。提出了钼粉表面镀铜层生长的＂扩散-缩小自催化＂模型。Mo powders of 3μm in mean particle size have been coated with copper by electroless plating technique in the pH of 11.5～13 and at temperature range of 55～75℃. The phase component of coated powder was determined by X-ray diffraction （XRD）, and the powder morphology observed by scanning electron microscope （SEM）. The results indicate that the optimum process for the electroless plating copper is at temperature of 65℃ and in pH of 12.5, in which the coating is of a bright maroon color with 46% （mass fraction） copper. The growth mechanism of electroless coating over the surface is diffusion-shrinkage self-catalytic model.

关 键 词：钼粉 化学镀铜 生长模型 

分 类 号：TQ153.14[化学工程—电化学工业]