高计算密度服务器组装结构分析  

Analysis of the Assemblage Architecture of High Computing Density Servers

作　　者：罗煜峰[1] 金杰[1] 

机构地区：[1]国防科技大学计算机学院,湖南长沙410073

出　　处：《计算机工程与科学》2008年第8期153-155,共3页Computer Engineering & Science

摘　　要：随着高计算密度服务器的峰值性能急剧提高,服务器的体积和功耗也急剧增加。因此,高计算密度服务器必须关注组装结构设计,以减小服务器的性能体积比、性能功耗比。根据计算节点板的布局,本文提出将高计算密度服务器的组装结构分为四类,详细描述了正在发展的有背板双面插箱(件)的组装结构;列举了最新的高计算密度服务器系统的组装结构参数,对各种组装结构进行了分析,并指出了高密度组装的发展趋势。With the rapid improvement of the peak performance on high computing density servers, the volume and power consumption of servers also increases sharply. Consequently, the proper assemblage architecture of high computing density servers should be critically considered, in order to reduce the performance/volume and performance/power ratios. In this paper, based on the layout of computer node boards, four kinds of assemblage architectures of high computing density servers are proposed. A particular description of the assemblage architecture of double-faced node case with backplane is given, which is in the process of development. By analyzing the parameters of the assemblage architecture of recent high computing density servers, the paper points out that the assemblage architecture of double-faced node case with backplane will be the development trend of the high density assemblage technology.

关 键 词：高计算密度服务器 组装结构 高密度组装 

分 类 号：TP338.4[自动化与计算机技术—计算机系统结构]