切削液对金刚石线锯切割单晶硅片质量的影响  

Research on Influence of Cutting Fluid on Slicing Single-crystal Silicon Wafers Quality Using Electroplated Diamond Wire Saw

作　　者：高玉飞[1] 葛培琪[1] 李绍杰[1] 侯志坚[1] 

机构地区：[1]山东大学机械工程学院,济南250061

出　　处：《武汉理工大学学报》2008年第8期86-88,共3页Journal of Wuhan University of Technology

基　　金：国家自然科学基金(50475132);山东省自然科学基金(Y2006F16)

摘　　要：选择4种切削液进行了电镀金刚石线锯切割单晶硅片的试验,研究了不同种类切削液对硅片的表面形貌、表面粗糙度、翘曲度和总厚度偏差的影响,分析了切削液对线锯切片过程的作用机理。研究结果表明,合成液对提高硅片的表面形貌质量,降低硅片的表面粗糙度、翘曲度和总厚度偏差的综合效果最好。Different cutting fluids were selected to slice Single-crystal silicon wafers by using electroplated diamond wire saw. The influences of cutting fluids on the silicon wafers surface appearance, surface roughness, warp and total thickness variation （TTV） were researched, and the cutting fluids action mechanism in wiresaw slicing was analyzed. The experimental results showed that the synthetic cutting fluid had a good effect to reduce the silicon wafer surface roughness, warp and TTV, and get a better wafer surface, The main reason was the synthetic cutting fluid had good lubricant and cleaning effect, which coulc re- duce the friction between the wire saw and wafer and avoid the silicon chips adhered to the wire saw surface ,so that the diamond abrasives maintain sharp cutting states.

关 键 词：金刚石线锯 单晶硅片 切片 切削液 

分 类 号：TH117[机械工程—机械设计及理论]