铜合金热变形行为研究  

Study on hot deformation behavior of copper alloy

作　　者：李银华[1] 刘平[1] 贾淑果[1] 张毅[2] 田保红[1] 任凤章[1] 

机构地区：[1]河南科技大学材料科学与工程学院,河南洛阳471003 [2]西安理工大学材料科学与工程学院,陕西西安710048

出　　处：《金属热处理》2008年第8期29-32,共4页Heat Treatment of Metals

摘　　要：在Gleeble-1500D热力模拟试验机上采用等温压缩试验,对Cu-Ni-Si-P合金和Cu-Ni-Si-Ag合金在高温压缩变形中的流变应力行为和组织变化进行了研究。结果表明,变形温度越高,合金越容易发生动态再结晶,应变速率越小,合金也越容易发生动态再结晶,且Cu-Ni-Si-P合金的流变应力在相同条件下高于Cu-Ni-Si-Ag合金的流变应力;同时变形温度对合金显微组织影响较大,在同样条件下,Cu-Ni-Si-Ag合金的晶粒尺寸大于Cu-Ni-Si-P合金的晶粒尺寸。The flow stress behavior of Cu-Ni-Si-P alloy and Cu-Ni-Si-Ag alloy during hot compression deformation was studied by isothermal compression test at Gleeble-1500D thermal-mechanical simulator. The results show that the higher the temperature, the more prone take place dynamic recrystallization, and the little strain rate, and the more prone take place dynamic recrystallization too, and at the same condition, the flow stress of Cu-Ni-Si-P higher than that of Cu-Ni-Si- Ag alloy. Simultaneity, the microstructures is strongly depended on the deformation temperature, and the grain size of Cu- Ni-Si-Ag alloy is bigger than that of Cu-Ni-Si-P alloy at the same condition.

关 键 词：Cu-Ni-Si-P合金 Cu-Ni-Si-Ag合金 热压缩变形 动态再结晶 热模拟 

分 类 号：TG146.1[一般工业技术—材料科学与工程] TG113.2[金属学及工艺—金属材料]