两种新型光固化灯与传统卤素灯照射复合树脂固化效果的比较  

The comparison of cure depth and surface hardness of composite resin cured with two kinds of new curing lights and traditional halogen curing light

作　　者：高承志[1] 莫珩[1] 

机构地区：[1]北京大学人民医院口腔科,100044

出　　处：《现代口腔医学杂志》2008年第5期476-479,共4页Journal of Modern Stomatology

摘　　要：目的探讨新型光固化灯StarlightS型LED光固化灯、DNX-TW-518型等离子弧光灯与传统的卤素光固化灯对Z100(3M,America)光固化复合树脂的固化深度和表面硬度的影响。方法根据ISO4049:2000标准,分别用两种新型光固化灯与传统卤素灯在标准条件下照射同一种复合树脂,检测其各自的固化深度和硬度。测试结果用SPSS软件进行方差分析和Dunnett-t检验,α=0.05。结果卤素光固化灯照射Z100复合树脂40s组的平均固化深度可达3.760mm,高于LED光固化灯照射10s组的平均固化深度2.285mm(P<0.05);略高于LED光固化灯照射20s组的平均固化深度3.693mm,但两者之间比较差别无统计学意义(P>0.05)。等离子弧光灯照射3s组、5s组的平均固化深度分别为1.984mm、2.575mm,均小于卤素灯照射40s组(P<0.05)。而等离子弧光灯照射10s组的平均固化深度为4.387mm,高于卤素灯照射40s组(P<0.05)。表面硬度的比较,卤素灯照射40s组的表面硬度为(74.242±6.144)GPa,高于LED灯10S组(36.816±2.914)GPa(P<0.05),高于LED灯20S组(55.309±4.472)GPa(P<0.05),高于等离子弧光灯5S组(48.175±4.026)GPa(P<0.05)。但略低于等离子弧光灯10s组(79.063±6.937)GPa,两者之间比较差别无统计学意义(P>0.05)。结论不同光固化灯照射光敏复合树脂在相同条件下的固化深度和表面硬度不同,两种新型光固化灯固化复合树脂的潜力与卤素灯相似甚至有些方面胜于卤素灯,适合于口腔临床应用。Objective To compare the cure depth and surface hardness of light curing composite resin Z1000 （ 3M , America） cured with new curing lights Starlight S LED curing light, DNX - TW - 518 plasma arc curing light and traditional halogen curing light. Methods The composite resin samples were cured respectively by the two kinds of new curing lights and traditional halogen curing light in the standard condition, and the cure depth and surface hardness were detected according to ISO 4049：2000 standards. All results were statistically analyzed with SPSS software by ANOVA and Dunnett - t test （α = 0. 05 ）. Results The average cure depth of Z100 composite resin cured by halogen curing light for 40 seconds was 3.760mm, which was higher than the average cure depth of Z100 cured by LED curing ligh for 10 seconds （ 2. 285mm） （ P 〈 0.05 ）. Compared with the average cure depth of Z100 composite resin cured by halogen curing light for 40 seconds, the average cure depth of Z100 composite resin cured by LED curing light for 20 seconds was 3.693mm, showed no statistical difference between them （ P 〉 0.05 ）. The average cure depth of ZI00 composite resin cured by plasma arc curing light for 3 seconds and 5 seconds was 1. 984mm and 2.575mm respectively, which were both lower when compared with that cured by halogen curing light for 40 seconds （ P 〈 0.05 ）. While the average cure depth of Z100 composite resin cured by plasma arc curing light for 10 seconds was 4. 387mm, which was higher when compared with that cured by halogen curing light for 40 seconds （ P 〈 0.05 ）. The surface hardness of Z100 composite resin cured by halogen curing light for 40 seconds was 74. 242 ±6. 144G Pa, which was higher than that cured by LED curing light for 10 seconds and 20 seconds （36.816 ± 2.914G Pa and 55. 309 ± 4.472G Pa）and cured by plasma arc curing light for 5 seconds （48. 175 ±4.026G Pa） （ P 〈0.05）. While compared with the surface hardness of Z100 composite resin cured by halogen curing light

关 键 词：复合树脂 固化深度 表面硬度 

分 类 号：R783[医药卫生—口腔医学]