铋对铜电解精炼中阴极铜沉积的微观结构的影响  

The Effect of Bismuth on Microstructure of the Cathodic Copper Deposition of Copper Electrorefining

作　　者：鲁道荣[1] 林建新[1] 

机构地区：[1]合肥工业大学化工学院

出　　处：《电化学》1997年第4期395-400,共6页Journal of Electrochemistry

摘　　要：采用扫描电镜、Ｘ射线衍射仪、原子吸收光度计和电子探针等仪器，研究了含有铋离子的酸性硫酸铜电解液中阴极铜沉积的电结晶生长形态、结晶的晶面取向以及铜沉积层的化学组成．研究结果表明：６５℃时，在通常的电流密度ｉ＝２００Ａ·ｍｏｌ／Ｌ－２下电解，铋不会在阴极沉积；铋离子对铜沉积层的晶面取向（２２０）基本不影响，电解液中存在高浓度铋离子时对（２２０）晶面生长起促进作用，对其它晶面生长起较强的抑制作用；铋离子影响铜沉积的电结晶生长形态和铜沉积层的晶胞尺寸．The electrocrystal formation, crystal orientation and the chemical composition of the cathodic copper deposition in the presence of Bi3+ in the electrolyte of acidified CuSO4 are studies by scanning electron microscopy, Xray diffraction, atomic absorption and EDAM. The results indicate that the Bi could′t deposit on cathode when copper electrolysed at common current density i=200 A·mol/L-2 and t=60 ℃. Bi3+ scarcely effected on the crystal orientation (220) of copper deposition. High concentration Bi3+ in the electrolyte promoted (220) growth and inhibited the other crystal orientation growth. Bi3+ effected on electrocrystal formation and the cell dimension of copper deposition.

关 键 词：铋 铜沉积 炼铜 电解精炼 

分 类 号：TF811.044[冶金工程—有色金属冶金]