适合复合共沉积用的液体微胶囊制备研究  

Study on liquid microcapsules for electrolytic co-deposition

作　　者：朱立群[1] 郭艳红[1] 李卫平[1] 刘慧丛[1] 

机构地区：[1]北京航空航天大学材料科学与工程学院,北京100083

出　　处：《功能材料》2008年第9期1507-1510,共4页Journal of Functional Materials

基　　金：国家自然科学基金资助项目(50771010)

摘　　要：采用水相分离法制备出粒径在2～10μm之间，适合复合电沉积用的液体微胶囊。通过微胶囊壁材的力学性能、水溶解性等研究，发现聚乙烯醇（PVA）和明胶的强度、弹性及镀液中的稳定性等可以满足复合电沉积对微胶囊壁材的要求。探讨了微胶囊壁材浓度、裳芯与囊壁比、搅拌、凝聚剂等微胶囊制备工艺对微胶囊的影响。制备出不同芯材（润滑油、有机硅树脂、缓蚀剂、憎水剂等）液体微胶囊和含有机硅树脂的液体微胶囊复合镀铜层。Liquid microcapsules used well for electrolytic co-deposition were prepared by means of separation in water phase in this paper. Diameter of microcapsules is in the size range of 2-10μm. The strength,elasticity and stability in the plating solution of PVA and gelatin were up to demand of electrolytic co-deposition for shell material after studying the property of mechanics and water solubility of shell material. Moreover the effects of the preparation process of microcapsules of shell material concentration,proportion of core material to shell materi- al,agitation and flocculant on microcapsules were discussed. Liquid microcapsule containing different core material of microcapsules （lube oil, organosilicon resin, corrosion inhibitor or hydrophobie agent） and electrode-positing composite copper coating containing organosilicon resin’s liquid microcapsules was obtained.

关 键 词：壁材 芯材 复合电沉积 液体微胶囊 

分 类 号：TB34[一般工业技术—材料科学与工程] TQ153.2[化学工程—电化学工业]