基于埋置式基板的3D-MCM封装结构的研制  

Development of a Three-Dimensional Multichip Module Based on Embedded Substrate

作　　者：徐高卫[1] 吴燕红[1] 周健[1] 罗乐[1] 

机构地区：[1]中国科学院上海微系统与信息技术研究所传感技术联合国家重点实验室,上海200050

出　　处：《Journal of Semiconductors》2008年第9期1837-1842,共6页半导体学报（英文版）

基　　金：微系统国家级实验室基金(批准号:9140A18050607ZK3403);应用材料研究与发展基金(批准号:06SA12)资助项目~~

摘　　要：研制一种用于无线传感网的多芯片组件(3D-MCM).采用层压、开槽等工艺获得埋置式高密度多层有机(FR-4)基板,通过板上芯片(COB)、板上倒装芯片(FCOB)、球栅阵列(BGA)等技术,并通过引线键合、倒装焊等多种互连方式将不同类型的半导体芯片三维封装于一种由叠层模块所形成的立体封装结构中;通过封装表层的植球工艺形成与表面组装技术(SMT)兼容的BGA器件输出端子;利用不同熔点焊球实现了工艺兼容的封装体内各级BGA的垂直互连,形成了融合多种互连方式3D-MCM封装结构.埋置式基板的应用解决了BGA与引线键合芯片同面组装情况下芯片封装面高出焊球高度的关键问题.对封装结构的散热特性进行了数值模拟和测试,结果表明组件具有高的热机械可靠性.电学测试结果表明组件实现了电功能,从而满足了无线传感网小型化、高可靠性和低成本的设计要求.A new type of 3D multichip module （3D-MCM） for wireless sensor networks is developed based on embedded FR-4 substrate,in which FCOB （flip-chip on board）, COB （chip on board）, BGA （ball grid array） technologies, and wire bonding and flipchip interconnection technologies are combined. The PBGA device and bare die are hybrid-integrated on the embedded multi-layer FR-4 substrate. By solder ball placement and reflow, the BGA is formed at the bottom of the 3D-MCM, Solder balls with different melting points are used for initial and final vertical interconnections for the sake of compatability of all levels of interconnections of the BGA by fellow soldering. The application of embedded substrate solves the problem that the top surface of the wirebonded chip overtops the solder bails under the condition that the chip was assembled on the same side of the substrate as the BGA of the MCM. The thermal management is conducted and the thermal related reliability of the 3D-MCM is simulated and evaluated. This kind of packaging structure satisfies the electrical performance and thermal requirement, and meets the challenge of minimization, high relia- bility, and low cost of the package design for wireless network.

关 键 词：3D-MCM 嵌入式基板 多种互连融合 焊球熔融兼容性 热机械可靠性 

分 类 号：TN405[电子电信—微电子学与固体电子学]