高温高湿下各向异性导电胶粘接界面的受力分析  

Interfacial Stresses Analyses of Ansotropic Conductive Adhesive Bonding under Thermal and Humidity Loads

作　　者：贾宏[1] 张军[1] 王定标[1] 

机构地区：[1]郑州大学化工学院,河南郑州450001

出　　处：《郑州大学学报（工学版）》2008年第3期81-84,共4页Journal of Zhengzhou University（Engineering Science）

摘　　要：在温度载荷和高温高湿载荷的作用下,对各向异性导电胶粘接的TAB试件进行受力分析,通过梁理论对薄膜梁单元的受力分析,建立了在温度和高温高湿载荷作用下粘接界面应力与应变关系,采用带有函数的奇异微分方程来求解,得到界面正应力和剪应力分布情况,并与有限元数值模拟得到的界面应力分布结果进行比较,计算结果和数值模拟结果相近,验证了计算的正确性.The specimens of TAB （Tape Automated Bonding） were bonding with the ACFs. The interfacial stresses analysis of ACF bonding specimens has been done under thermal and humidity loads. Beam theory models have been used to derive the integral equation of stress - strain relation through the beam element stresses analysis of film. The ACF interfacial relation of stresses and strain could be found by the boundary condition and equilibrium functions. The shear and normal stresses of the bonding interface can be obtained by using the integral equations. The calculation of the beam model and the FEM simulation results were close after comparison.

关 键 词：各向异性导电胶 界面应力 温度载荷 湿度载荷 

分 类 号：TQ430.1[化学工程]