MEMS压阻加速度传感器阻尼特性研究  

Research on Damping Characteristics of MEMS Piezoresistive Accelerometer

作　　者：卞玉民[1] 郑锋[1] 何洪涛[1] 

机构地区：[1]中国电子科技集团公司第十三研究所,石家庄050051

出　　处：《微纳电子技术》2008年第8期466-469,479,共5页Micronanoelectronic Technology

摘　　要：研究了空气阻尼对MEMS压阻加速度传感器性能的影响,建立了传感器动力学模型和空气阻尼模型,分析了空气间隙大小与传感器阻尼系数的相互关系,通过控制空气间隙可以达到控制加速度传感器阻尼的目的。根据分析结果设计了三明治结构封装的传感器,应用有限元仿真软件,对传感器的应力和应变进行了仿真计算,完成传感器结构参数设计;采用MEMS体硅加工工艺和圆片级封装工艺,制作了MEMS压阻加速度传感器。测试结果表明,采用三明治结构封装形式,可以控制压阻加速度传感器的阻尼特性,为提高传感器性能提供了途径。The effect of the gas damp on the microelectromechanical system （MEMS） piezoresistive accelerometer was studied. The dynamic model and air damp model for the accelerometer were established. The relationship between the gas gap and the damping coefficient was analyzed. A sandwich structure for the accelerometer was designed based on the analysis result. The accelerometer stress and stain was simulated and analyzed using the finite element method, and the structure parameters of the piezoresistive accelerometer were designed. The MEMS pie- zoresistive accelerometer was fabricated with micromachining process and wafer level packaging （WLP）. The test results prove that the sandwich structure can control the accelerometer damping characteristics and provide approaches for improving the performance.

关 键 词：微电机系统 压阻 加速度传感器 阻尼 圆片级封装 

分 类 号：TH703[机械工程—仪器科学与技术] TP212.1[机械工程—精密仪器及机械]