大功率白光LED的封装技术研究  

Research on Encapsulation Technology of Large Power White-Light LED

作　　者：吴中林[1] 徐华斌[1] 刘传先[1] 陈林[1] 

机构地区：[1]上海第二工业大学理学院,上海201209

出　　处：《上海第二工业大学学报》2008年第3期170-173,共4页Journal of Shanghai Polytechnic University

摘　　要：研究了40 mil×40 mil瓦级大功率白光LED封装的关键技术,采用1W的蓝光芯片加YAG荧光粉封装的白光LED,在350 mA的恒定电流驱动下,获得了130.3lm的发光通量,发光效率达108.6lm/W,显色指数约为91.5。The key encapsulation technology of 40mil×40mil large power white-light LED has been researched. The white light LED was encapsulated by covering YAG fluorescence powder on the surface of blue-light chip. In the invariable driving current of 350mA, the luminous flux is 130.31m and the emitting efficiency is 108.61m/W. The color rendering index is about 91.5.

关 键 词：功率型LED 封装 白光 光衰 发光效率 

分 类 号：TN312.8[电子电信—物理电子学]