采用DOE方法优化无铅波峰焊接工艺  

The Optimization Process of Lead-free Wave Soldering by DOE

作　　者：李辉[1] 史建卫 李明雨[1] 熊振山 谢军 

机构地区：[1]哈尔滨工业大学现代焊接生产技术国家重点实验室,哈尔滨150001 [2]日东电子科技(深圳)有限公司,广东深圳518103

出　　处：《电子工业专用设备》2008年第9期30-34,共5页Equipment for Electronic Products Manufacturing

摘　　要：无铅波峰焊接工艺相比有铅波峰焊接工艺显得复杂和难以控制。通过采用DOE和波峰焊工艺分析相结合的方法,设计无铅波峰焊工艺,大大降低了缺陷率,提高了无铅波峰焊接质量,在生产实践中具有很大的指导意义。The process of lead-free wave soldering compared to SnPb wave soldering is so complex and difficult to control. In this paper the process was designed by the combination of DOE （design of experiment） and analysis of the process, and the amount of defect declined greatly, also the quality of soldering joints was enormously improved. This is method which has signification for guidance in production.

关 键 词：无铅波峰焊 DOE 工艺分析 焊接缺陷 焊接质量 

分 类 号：TG453.9[金属学及工艺—焊接]