急冷型SnAgCu系钎料箔带制备及物理性能测试  

Preparation of Down Quenching SnAgCu Solder Foil and Analysis on Microstructure and Property

作　　者：张鑫[1] 黄笑宇[1] 张柯柯[1] 赵国际 王辉[1] 

机构地区：[1]河南科技大学材料科学与工程学院,河南洛阳471003 [2]焦作市技师学院,河南焦作454003

出　　处：《热加工工艺》2008年第17期111-112,115,共3页Hot Working Technology

基　　金：河南科技大学青年科学研究基金资助项目(2007QN057);河南科技大学SRTP资助项目(2007013)

摘　　要：采用单辊法制备了急冷型SnAgCu系钎料箔带,对其进行了物理性能测试和显微组织分析,并与相同成分的常态钎料合金进行了分析比较,结果表明:采用单辊法制备急冷型SnAgCu系钎料箔带是可行的,所制备的钎料箔带熔化温度及固-液相线温度区间均低于相同成分的常态钎料合金,且其显微组织也更为细化。Using the method of single-roller, the down quenching SnAgCu solder foil was prepared. The physical properties and microstructure of the solder foil were tested and compared with the common solder alloy of the same component. The results show that the method of single-roller is suitable for preparing the down quenching SnAgCu solder foil, its melting temperature and the solid-liquid temperature interval are lower than those of the common solder alloy, and the microstructure is also finer.

关 键 词：单辊法 急冷型 SNAGCU 熔化温度 显微组织 

分 类 号：TG425[金属学及工艺—焊接]