Cu/Zr纳米多层膜微结构与力学性能  

Microstructure and Mechanical Performance of Cu/Zr Nano-multilayer Films

作　　者：苑永涛[1] 方敬忠[1] 刘红[1] 陈志强[1] 

机构地区：[1]中国科学院光电技术研究所,成都610209

出　　处：《光电工程》2008年第10期17-20,共4页Opto-Electronic Engineering

摘　　要：本文利用直流磁控溅射方法在石英玻璃基片上制备了一系列自支撑Cu/Zr纳米多层膜,使用箱式电炉对多层膜进行退火处理,利用显微硬度计、X射线衍射仪、扫描探针显微镜表征了多层膜的力学性能与微观结构,研究了不同工艺参数对纳米多层膜性能的影响。研究结果表明:当Cu调制层厚从42 nm增加至140 nm时,多层膜显微硬度从4.9 GPa逐渐降低至4.0 GPa;当Zr调制层厚从3.2 nm增加至4.8 nm时,显微硬度值从6.51 GPa降低至5.64 GPa,硬度值降低13.4%,而从4.8 nm增至8 nm时,显微硬度值变化不大(约5.7 GPa);合适的温度退火时,多层膜微观缺陷消失,表面形貌更均匀,显微硬度增加。利用Chu和Barnett提出的硬度增强理论模型对Cu/Zr纳米多层膜表现出的超硬现象进行了理论分析和解释。Cu/Zr nano-multilayer films are prepared by Direct Current （DC） magnetron sputtering in the silex substrate, and the box-type furnace is used to anneal. Micro-sclerometer, X-ray Diffractometer （XRD） and Scanning Probe Microscope （SPM） are used to analyze the mechanical performance and microstructure of Cu/Zr nano-multilayer films. The relation of process parameters and performance is investigated. Results show that： When Cu modulation thickness varies between 42 nm and 140 nm, the microhardness of Cu/Zr nano-multilayer films gradually reduces from 4.9 GPa to 4.0 GPa; When Zr modulation thickness is from 3.2 nm to 4.8 nm, the hardness decreases from 6.51 GPa to 5.64 GPa, hardness value decreases 13.4%, then Zr modulation thickness is from 4.Snm to 8nm, and microhardness tends a steady value（about 5.7 GPa）; When annealed suitably, the superficial appearance and microhardness of Cu/Zr nano-multilayer films get better. The results accord with the model of hardness enhancement which is proposed by X Chu and S A Barnett.

关 键 词：磁控溅射 纳米多层膜 显微硬度 退火 

分 类 号：O484.2[理学—固体物理]