氨基磺酸盐镀镍过程中内应力产生及变化的因素与机理  

Mechanisms for Formation of Internal Stress in Electroplated Nickel Coating from Snlphamate Bath and Factors Affecting the Internal Stress

作　　者：李延伟[1,2] 姚金环[1] 杨哲龙[2] 

机构地区：[1]桂林工学院材料与化学工程系,广西桂林541004 [2]哈尔滨工业大学应用化学系,黑龙江哈尔滨150001

出　　处：《材料保护》2008年第10期34-36,2,共3页Materials Protection

基　　金：桂林工学院科研启动费(006206236)资助

摘　　要：电沉积镍用途广泛,但常因应力问题而影响其应用。为此,采用薄片阴极弯曲法研究了氨基磺酸盐体系电镀镍层内应力的影响因素并对镀层内应力的形成机理进行了初步探讨。结果表明,升高电解液温度或降低阴极电流密度可以降低电镀镍层的拉应力;当电解液pH值为4.3时,电镀镍层具有最大的压应力,高于或低于此值时镀层的压应力减小,直至出现拉应力;电解液中Cl-浓度的增加会增加电镀镍层的拉应力。X射线衍射分析表明,电镀镍层的应力特性与其微观结构密切相关,镀层处于压应力时具有(200)择优取向;镀层处于拉应力时具有(220)和(111)择优取向。The factors affecting the internal stress in electroplated nickel coating deposited from a sulphamate bath were investigated using cathodic curvature method , and the mechanisms for the formation of internal stress in the Ni coating were also discussed. Moreover, the correlation between the internal stress and microstructure of the Ni coating was analyzed by means of X-ray diffraction. Results indicated that the tensile stress of the nickel coating decreased with increasing temperature or decreasing cathodic current density. The nickel coating deposited from the bath with at a pH value of 4.3 showed the largest compressive stress, and the tensile stress increased with increasing concentration of chlorine ions. Besides, the nickel coating with tensile stress was dominated by (220) and (111) preferential orientation, while that with compressive stress was dominated by (200) preferential orientation.

关 键 词：镀镍 内应力 氨基磺酸盐 氯离子 

分 类 号：TQ153.1[化学工程—电化学工业]