线路板生产工艺研究进展  

Research Development on Circuit Board Productive Technology

作　　者：卢乐善[1,2] 梁建祺[1] 宁寻安[1] 

机构地区：[1]广东工业大学环境科学与工程学院,广东广州510006 [2]东莞市环境保护局,广东东莞518057

出　　处：《广东化工》2008年第10期68-71,共4页Guangdong Chemical Industry

摘　　要：随着电子工业的飞速发展,对环保的要求也越来越高,适应绿色环保严格要求的环境问题,已成为PCB设计、制造中的不可回避的共性问题。解决PCB的环境问题,达到绿色化,在很大程度上要依赖生产工艺方面。文章系统介绍线路板生产工艺,特别是孔金属化工艺的发展。分别对传统工艺(化学沉铜工艺)和银胶、铜胶贯孔工艺进行介绍,并对两种工艺的优缺点以及在环保方面的应用进行比较,提出了孔金属化的发展方向。With the rapid development of the electronics industry, environmental requirements became more and more higher. Adaptation green stringent requirements of environmental problems have become a PCB design, manufacture of the common problems that could not be avoided. To resolve environmental problems, large extent dependent on production technology. The paper presented a review on the circuit board productive technology, especially the development of hole metallization. The tradition technology（Electroless PTH） and the silver （copper） paste through hole technology; was introduced the advantages and disadvantages of both the environmental aspects was compared. The hole metallization development direction was suggested.

关 键 词：线路板 生产工艺 化学沉铜 银胶 铜胶贯孔工艺 

分 类 号：TN4[电子电信—微电子学与固体电子学]