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作 者:尹昌平[1] 肖加余[1] 曾竟成[1] 李建伟[1] 刘钧[1]
机构地区:[1]国防科技大学航天与材料工程学院,长沙410073
出 处:《宇航材料工艺》2008年第5期67-70,共4页Aerospace Materials & Technology
摘 要:以GA327改性芳胺为固化剂,对应用于RTM工艺的E-44环氧树脂体系的流变特性进行了研究。在黏度实验和DSC热分析实验的基础上,依据双阿累尼乌斯方程建立了与实验数据较为吻合的流变模型。结果表明:E-44/GA327体系在60~85℃内黏度低于800mPa·S,且低黏度保持时间大于20min,在75~85℃内黏度低于300mPa·S的时间可达10min。所得到的模型可揭示树脂在不同工艺条件下的黏度变化规律,定量预报树脂的低黏度平台工艺窗口,为该树脂RTM工艺窗口的确定以及RTM工艺参数优化提供科学依据。By using GA327 as curing agent, the theological behavior of E -44 resin system for resin transfer molding was studied with DSC analysis and viscosity experiments. A rheological model based on the dual-Arrhenius equation which was in good agreement with the results of experiments was established and used to simulate the rheological behavior of E - 44 resin system. The results show that viscosity of the resin system is under 800 mPa. s at the temperature range from 60℃ to 85℃, and the low viscosity maintaining time is more than 20 min. Furthermore, the viscosity is under 300 mPa's at the temperature range from 75℃ to 85℃, and the low viscosity maintaining time is more than 10 min. The processing window of E -44 resin system can be well determined based on the developed model. The rheological model is important for processing window forecast and processing parameter optimization.
分 类 号:TQ323.5[化学工程—合成树脂塑料工业] TS201.7[轻工技术与工程—食品科学]
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