TLP连接机制与中间层问题的探讨  

Study on Transient Liquid Phase Bonding Processes and Interlayer

作　　者：石昆[1] 于治水[1] 王付鑫[1] 

机构地区：[1]上海工程技术大学材料工程学院,上海201620

出　　处：《上海工程技术大学学报》2008年第3期235-238,253,共5页Journal of Shanghai University of Engineering Science

摘　　要：瞬时液相扩散焊连接(TLP)提供了一种在低温下连接各种材料的焊接方法。TLP连接方法能够产生无界面的、无中间层残留的高强度接头,在TLP连接过程中由于降熔剂的作用使得液相中间层只能够向金属母材扩散,从而产生等温定向凝固。可见中间层中扩散是TLP连接过程的关键问题,为此阐述了中间层中各项因素对连接时间的影响,结果发现中间层的厚度以及降熔剂的选择对连接时间都有很大影响。因此,应尽量避免中间层金属间化合物的产生。Transient L perature . It is capa iquid Phase（TLP）bonding offers a method of joining the composite material in low tern- of producing nearly invisible joints that have strong strength without interface and in- the bonding process, so the influence of the interlayer factor was expatiated on the bonding time. It was found that the interlayer thickness and the select of the melting point depressants have the strong influence on the bonding time. In addition, it should avoid the intermetallic compound which has the bad influence on the TLP bonding process.

关 键 词：瞬时液相扩散焊连接 中间层 连接机制 

分 类 号：TP454[自动化与计算机技术]