环氧灌封料中无机填料的研究  

Advance of Application of Inorganic Filler in Epoxy Potting Compound

作　　者：狄宁宇 沈鉴烽 曹万荣 刘攀登 郑芳 

机构地区：[1]浙江荣泰科技企业有限公司,浙江嘉兴314007

出　　处：《绝缘材料》2008年第5期27-29,共3页Insulating Materials

摘　　要：简述了环氧灌封料中无机填料的使用种类和性能,分析了纳米TiO2、SiO2等粒子对材料性能的影响。同时利用双层模型和公式模型解释了颗粒含量、颗粒大小等影响材料性能的原因。The latest researches on inorganic fillers in epoxy resins for electronic packaging were introduced; and their characteristics were discussed. The applications and properties of nano TiO2, SiO2 were mainly discussed. The effect of particle content and size on material properties was explained by using dual layer model and formula model.

关 键 词：环氧树脂 封装材料 无机填料 纳米复合材料 

分 类 号：TM215[一般工业技术—材料科学与工程] TQ45[电气工程—电工理论与新技术]